Cadence Integrity 3D-IC Platform

    Cadence Integrity 3D-IC Platform

    Leader

    Cadence Integrity 3D-IC Platform is a software platform for planning, implementing, and analyzing multi-die (2.5D/3D) systems, integrating system/stack planning, digital implementation, package/interposer/substrate design, and system-level signoff into a common database and single cockpit.

    Est 1988|Valuation $90.7B|Raised $4B
    LinkedIn 521K|Website|Web traffic 637K|FTEs 11,412|HQ San Jose, California, US